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Cierra Nguyen

Our Group VP and GM of Etch Product Group Harmeet Singh shares how Lam revolutionizes 3D NAND technology with Lam Cryo 3.0. Please share with your networks!

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The Path to 1,000-Layer 3D NAND

Lam Cryo 3.0 is not just a step forward, but a leap into the future of 3D NAND manufacturing, enabling devices with 400 layers and beyond to achieve top-tier performance and productivity. 
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Watch the video to learn more about @Lam Research﻿'s newest dielectric etch technology. https://bit.ly/3yCkBVv

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Lam Cryo 3.0 delivers precise, high-aspect ratio (HAR) features for 3D NAND devices with 400+ layers. Explore how @LamResearch redefines the future of memory manufacturing. 💡 https://bit.ly/3yCkBVv

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Lam Cryo 3.0, compatible with our Flex® and Vantex® platforms, helps manufacturers enhance production efficiency. Learn more about @LamResearch and its industry-leading approach. https://bit.ly/3yCkBVv

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